Power chips are attached to outside circuits through packaging, and their efficiency depends on the support of the packaging. In high-power circumstances, power chips are typically packaged as power components. Chip interconnection refers to the electric connection on the top surface area of the chip, which is usually aluminum bonding cable in traditional modules. ^
Conventional power component bundle cross-section
Presently, business silicon carbide power components still primarily use the packaging innovation of this wire-bonded conventional silicon IGBT component. They face troubles such as large high-frequency parasitic parameters, insufficient warmth dissipation capacity, low-temperature resistance, and inadequate insulation stamina, which restrict using silicon carbide semiconductors. The display of exceptional efficiency. In order to solve these issues and completely manipulate the significant prospective advantages of silicon carbide chips, several brand-new packaging modern technologies and remedies for silicon carbide power modules have actually emerged in recent years.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold wire bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have established from gold wires to copper wires, and the driving force is expense reduction; high-power tools have actually developed from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance product performance. The better the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a solid copper bridge soldered to solder to attach chips and pins. Compared to traditional bonding product packaging techniques, Cu Clip innovation has the adhering to benefits:
1. The link between the chip and the pins is constructed from copper sheets, which, to a certain degree, replaces the common wire bonding approach in between the chip and the pins. As a result, a special bundle resistance worth, greater existing flow, and much better thermal conductivity can be obtained.
2. The lead pin welding area does not need to be silver-plated, which can fully save the expense of silver plating and inadequate silver plating.
3. The item appearance is totally constant with typical products and is generally utilized in web servers, mobile computer systems, batteries/drives, graphics cards, motors, power supplies, and other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both eviction pad and the Resource pad are clip-based. This bonding technique is much more expensive and complex, but it can achieve far better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cable bonding method
The source pad makes use of a Clip technique, and the Gate makes use of a Cable method. This bonding method is a little more affordable than the all-copper bonding technique, saving wafer area (applicable to really tiny entrance areas). The process is simpler than the all-copper bonding technique and can get much better Rdson and far better thermal effect.
Distributor of Copper Strip
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